SHFE tin prices fluctuated downward, and spot market transactions were relatively weak [SMM Tin Midday Review]

The 26th China International Industry Fair is being held at the National Exhibition and Convention Center, where over a hundred Shanghai scientific and technological achievements are on display in the Innovation Technology Pavilion. At the Landau Suiyan booth, an EUV light source system prototype is making its debut at the fair. It is currently the most advanced domestically developed EUV light source prototype on public display, and is also known as the "heart" of high-end lithography machines. EUV light sources are one of the three core parts for manufacturing advanced process chips at 7 nm and below. They have long been subject to technology monopolies and embargoes outside China, making them a key link constraining China's ability to independently control high-end chips. On-site staff introduced that the light source system on display has achieved 90% localisation, with the vast majority of core parts independently developed through R&D. Its technical route is consistent with that of leading international producers, and it can be used for chip exposure testing. Although mass production is still 3–5 years away, this breakthrough marks a key step in moving China's EUV light source from the laboratory toward industrialisation.

According to TuringQ, on October 14, TuringQ formally signed a strategic cooperation agreement with Shenzhen Zhicheng Computing Network Technology Co., Ltd. (Zhicheng Computing Network) and Asia Computing Network and Quantum Computing Technology Co., Ltd. (Asia Computing). The three parties will work together to build a quantum-supercomputing-intelligent integrated computing center in the Guangdong-Hong Kong-Macao Greater Bay Area, creating a new-type computing infrastructure that integrates quantum computing, high performance computing, and artificial intelligence.

TSMC reported Q3 (ended September) profit that beat market expectations. Despite growing concerns over long-term AI infrastructure buildout, the world's chipmaking giant maintained its rapid growth momentum. TSMC said Q3 net profit rose 69% YoY to NT$763.1 billion ($23.6 billion), exceeding the average analyst estimate. Earlier, TSMC reported revenue for the same period jumped 51% YoY, also above market expectations, pushing Q3 revenue to $47 billion. TSMC said revenue growth has accelerated over the past two quarters, and the company has also stepped up its capacity expansion. TSMC previously said capital expenditure this year would reach a record $64 billion. Meanwhile, market expectations for TSMC's 2027 capex keep being raised, a metric seen as a key barometer for the industry's outlook. Goldman Sachs now expects TSMC's 2027 capex to reach $85 billion, while UBS projects $90 billion, both above the consensus estimate of $75 billion. TSMC is currently trying to build and equip around 20 fabs simultaneously at home and outside China, an unprecedented pace of expansion. By comparison, the company typically used to have only four to five new fab buildings under construction at the same time.